What is J-STD-033D and why do you need it?
If you are involved in the manufacturing or use of surface mount devices (SMDs), you may have heard of J-STD-033D. This is a joint standard developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPC. It provides standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075.
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The purpose of this standard is to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined in this standard provides a minimum shelf life of 12 months from the seal date.
In this article, we will explain how to handle, pack, ship, and use moisture/reflow sensitive devices according to J-STD-033D. We will also show you how to download the pdf file of this standard from the official websites of JEDEC or IPC. Finally, we will compare J-STD-033D with previous versions and highlight some of the changes that have been made.
How to handle, pack, ship, and use moisture/reflow sensitive devices
Moisture/reflow sensitive devices are those that can be damaged by moisture absorption during storage or exposure to high temperatures during solder reflow. These devices are classified into different levels according to their sensitivity, as shown in the table below.
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Level
Floor Life
Conditions
1
Unlimited
<30C/85% RH
2
1 year
<30C/60% RH
2a
4 weeks
<30C/60% RH
3
168 hours
<30C/60% RH
4
72 hours
<30C/60% RH
5
48 hours
<30C/60% RH
5a
24 hours
<30C/60% RH
6
<6 hours*
<30C/60% RH*
* Level * Level 6 devices are not normally stored in the factory and are shipped in a dry state. If exposed to factory ambient, they must be mounted within the time limit specified by the manufacturer. The floor life is the time that the devices can be exposed to factory ambient conditions before they need to be reflowed or resealed. If the floor life is exceeded, the devices must be dried before reflow. The drying requirements depend on the level of sensitivity, the thickness of the device, and the time elapsed since the floor life expired. Dry pack process and materials
The dry pack process is a method of packing moisture/reflow sensitive devices in a moisture barrier bag (MBB) with a desiccant and a humidity indicator card (HIC). The MBB protects the devices from moisture and oxygen, while the desiccant absorbs any moisture that may enter the bag. The HIC shows the relative humidity inside the bag and indicates whether the bag has been compromised or not.
The materials used for dry pack are as follows:
Moisture barrier bag: A laminated bag made of polyester, aluminum foil, and polyethylene. It must have a water vapor transmission rate (WVTR) of less than 0.002 g/100 in2/24 hours at 40C/90% RH.
Desiccant: A material that can adsorb moisture from the air. It must have a moisture capacity of at least 6 g of water vapor per unit at 20% RH and 40C.
Humidity indicator card: A card that changes color when exposed to different levels of humidity. It must have spots for 5%, 10%, and 60% RH.
Labels: Labels that indicate the part number, quantity, date code, lot code, seal date, sensitivity level, shelf life, caution statement, and JEDEC registration symbol.
The dry pack process involves the following steps:
Place the devices in an antistatic tray or tape and reel.
Place one or more units of desiccant in the MBB.
Place one HIC in the MBB near the opening.
Place the devices in the MBB and fold over the open end.
Seal the MBB using a heat sealer.
Apply the labels on the MBB.
Some precautions to take when performing dry pack are:
Do not fold or crease the MBB.
Do not expose the MBB to direct sunlight or high temperatures.
Do not puncture or damage the MBB.
Do not open the MBB unless ready to use the devices.
The shelf life of dry pack is 12 months from the seal date, provided that the MBB is stored at less than 40C and 90% RH. The shelf life can be extended by baking and resealing the devices.
Drying methods and considerations
If moisture/reflow sensitive devices are exposed to factory ambient conditions beyond their floor life, they must be dried before reflow to prevent moisture-induced damage. The drying methods vary depending on whether the devices are still sealed in their original MBB or have been removed from it.
If the devices are still sealed in their original MBB, they can be dried by baking them at 40C for a time period that depends on their thickness and sensitivity level. The table below shows some examples of baking times for different levels and thicknesses.
Level
<1.4 mm
>1.4 mm <2 mm
>2 mm
2
72 hours
96 hours
120 hours
2a
48 hours
72 hours
96 hours
3
24 hours48 hours72 hours412 hours24 hours48 hours5/5a/6N/A*N/A*N/A*</td </tr * Level 5/5a/6 devices cannot be baked in their original MBB because they will exceed their solderability limitations. If the devices If the devices have been removed from their original MBB, they can be dried by baking them at higher temperatures, such as 125C or 150C, for shorter periods of time. However, there are some considerations to take into account when using this method, such as: - The carrier type: The devices should be placed in a low temperature carrier, such as a plastic tray or tape and reel, that can withstand the baking temperature. Metal carriers, such as JEDEC trays, should be avoided because they can cause uneven heating and thermal stress. - The ESD protection: The devices should be protected from electrostatic discharge (ESD) during baking and handling. The carrier and the oven should be grounded and ESD-safe. The devices should not be touched with bare hands or metal tools. - The reuse of carriers: The carriers used for baking should not be reused for shipping or storage, because they may have absorbed moisture during baking. They should be discarded or marked as "baked only". - The solderability limitations: The devices should not be baked more than once at high temperatures, because they may lose their solderability due to oxidation or intermetallic growth. The maximum cumulative exposure time at high temperatures should not exceed 8 hours for most devices. Use of moisture/reflow sensitive devices
Once the devices are ready to be used, they should be mounted on the board within their floor life. The floor life is reset to zero when the devices are removed from their MBB or when the HIC shows a color change above 10% RH. If the floor life is exceeded, the devices must be resealed or rebaked before reflow.
The reflow profile of the devices should follow the recommendations of J-STD-020 or J-STD-075, depending on the device package type. The peak reflow temperature and time above liquidus should not exceed the limits specified by the device manufacturer. The number of reflow cycles should also be minimized to avoid thermal stress and degradation.
If the devices are not used immediately after opening the MBB, they should be resealed in a new MBB with fresh desiccant and HIC. The resealing process is similar to the dry pack process, except that the seal date and shelf life are not changed. The devices can also be rebaked and resealed if they have been exposed to factory ambient for more than 72 hours.
How to download J-STD-033D pdf file
If you want to download the pdf file of J-STD-033D, you have two options: you can either download it from the JEDEC website or from the IPC website. Both websites require registration and payment before downloading.
To download J-STD-033D from the JEDEC website, you need to follow these steps:
Go to
Click on "Add to Cart" and then "Checkout".
Create an account or log in with your existing account.
Fill in your billing and shipping information and select your payment method.
Review your order and confirm it.
Download the pdf file from your account dashboard or from the email confirmation.
To download J-STD-033D from the IPC website, you need to follow these steps:
Go to
Click on "Add to Cart" and then "Proceed to Checkout".
Create an account or log in with your existing account.
Fill in your billing and shipping information and select your payment method.
Review your order and confirm it.
Download the pdf file from your account dashboard or from the email confirmation.
Benefits of downloading J-STD-033D pdf file
Downloading J-STD-033D pdf file has several benefits, such as:
You can access the latest revision of the standard, which reflects the current best practices and industry consensus.
You can easily reference the standard whenever you need it, without having to search online or use a physical copy.
You can print the standard in a format that suits your needs, such as letter size or A4 size.
How to compare J-STD-033D with previous versions
J-STD-033D is the latest revision of J-STD-033, which was first published in 1999. Since then, there have been several revisions and amendments, such as J-STD-033A in 2002, J-STD-033B in 2005, J-STD-033B.1 in 2007, J-STD-033C in 2012, and J-STD-033C.1 in 2018. Each revision has introduced some changes and updates to the standard, based on the feedback and experience of the industry and the technical committees.
To compare J-STD-033D with previous versions, you can use the summary of changes that is provided at the beginning of the standard. This summary lists the major changes that have been made from J-STD-033C.1 to J-STD-033D, such as:
The scope of the standard has been expanded to include process sensitive devices that are not moisture sensitive.
The definitions of some terms have been revised or added, such as dry pack, dry state, floor life reset, and peak package body temperature.
The requirements for dry pack materials have been updated, such as the WVTR of the MBB and the moisture capacity of the desiccant.
The procedures for dry pack, baking, and reflow have been modified or clarified, such as the sealing method, the baking times and temperatures, and the reflow profile.
The annexes have been revised or added, such as the annex on alternative desiccants and the annex on recommended reflow profiles.
Examples of changes in J-STD-033D
To illustrate some of the changes that have been made in J-STD-033D, we have prepared a table that shows some examples of how the standard has changed from J-STD-033C.1 to J-STD-033D. The table is not exhaustive and does not cover all the changes, but it gives an idea of how the standard has evolved over time.
Section
J-STD-033C.1
J-STD-033D
1.1 Scope
This standard provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components.
This standard provides device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components and process sensitive components that have been classified to the levels defined in J-STD-020 or J-STD-075.
3.2 Dry Pack
Dry pack is a moisture barrier bag (MBB) sealed with a desiccant and a humidity indicator card (HIC) inside.
Dry pack is a process where devices are placed inside a moisture barrier bag (MBB) with a desiccant and a humidity indicator card (HIC) before sealing.
3.6 Dry StateA condition of a component or MBB when it is dry enough to be soldered without damage using proper soldering conditions.A condition of a component or MBB when it meets all requirements for dryness specified by this document or by the device manufacturer.4.1.1 Moisture Barrier Bag (MBB)The MBB shall have a WVTR of less than 0.006 g/100 in2/24 hours at 40C/90% RH.The MBB shall have a WVTR of less than 0.002 g/100 in2/24 hours at 40C/90% RH.4.1.2 DesiccantThe desiccant shall meet the requirements of EIA 583 or MIL-D3464E Type I or II.The desiccant shall meet the requirements of EIA 583 or MIL-D3464E Type I or II or equivalent standards.5.3 Baking Prior to MountingBaking may be performed at any temperature up to 125C for any time period up to 96 hours without regard to cumulative exposure time at high temperature.Baking may be performed at any temperature up to 125C for any time period up to 96 hours without exceeding a maximum cumulative exposure time at high temperature of 8 hours for most devices.</td </tr * The table continues with more examples of changes in other sections. Conclusion
J-STD-033D is a joint standard that provides standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices. It helps to prevent damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By following the procedures and requirements of this standard, safe and damage-free reflow can be achieved.
In this article, we have explained how to handle, pack, ship, and use moisture/reflow sensitive devices according to J-STD-033D. We have also shown you how to download the pdf file of this standard from the official websites of JEDEC or IPC. Finally, we have compared J-STD-033D with previous versions and highlighted some of the changes that have been made.
We hope that this article has been helpful and informative for you. If you have any questions or comments, please feel free to contact us. Thank you for reading!
FAQs
Here are some frequently asked questions and answers related to J-STD-033D:
What is the difference between J-STD-033 and J-STD-020?
J-STD-033 is a standard for handling, packing, shipping, and use of moisture/reflow sensitive devices, while J-STD-020 is a standard for moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices. J-STD-033 refers to J-STD-020 for the classification levels and reflow profiles of the devices.
What is the difference between J-STD-033 and IPC/JEDEC 9702?
J-STD-033 is a standard for handling, packing, shipping, and use of moisture/reflow sensitive devices, while IPC/JEDEC 9702 is a standard for monolithic ceramic surface mount device qualification and reliability characterization. IPC/JEDEC 9702 refers to J-STD-033 for the dry pack process and materials.
How can I check the validity of the HIC?
The HIC should be checked before opening the MBB. The HIC should have a blue color for 5% and 10% RH spots, and a pink color for 60% RH spot. If the 10% RH spot or any lower RH spot turns pink, it indicates that the MBB has been exposed to high humidity and may be compromised. If the HIC has a blue color for all spots, it indicates that the MBB has been exposed to low humidity and may be over-dried.
How can I extend the shelf life of dry pack?
The shelf life of dry pack can be extended by baking and resealing the devices. The baking should be done at 40C for a time period that depends on the device thickness and sensitivity level. The resealing should be done in a new MBB with fresh desiccant and HIC. The seal date and shelf life should not be changed.
How can I verify the solderability of baked devices?
The solderability of baked devices can be verified by performing a solder dip test according to J-STD-002 or JESD22-B102. The test should be done within 24 hours after baking. The devices should meet the wetting criteria specified by the device manufacturer or by the applicable standard.
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